Laser Engraving, Vinyl Cutter, UV Printer - GCC

The GCC LaserPro Application Lab presents you fine quality earrings created with GCC LaserPro FMC 280 through the assistance of the Thin Metal Film Clamping Device.

With a few simple steps including fixing the pipe on the rotary clamping axis, you can cut or create holes on the pipe without further hassles.

The GCC LaserPro Application Lab of the month reveals how FMC 280 creates additional holes on processed items. Watch FMC 280 waves its magic wand now!

Nonwoven fabric is a fabric-like material made from long fibers, bonded together by chemical, mechanical, heat or solvent treatment.

The GCC LaserPro Application Lab characterizes another packaging project by using EPE (Expanded Polyethylene), a material with exceptional elasticity and impact strength that is widely used in protective packaging.

Engraving is the most common technique of laser processing. To ensure high engraving quality, a remarkable color contrast must be presented after the material is engraved.

GCC LaserPro Laser Engravers perform efficient cutting and create folding lines with its exclusive bridge cutting function that comes with the driver, you can swiftly create any inner packages to accommodate any need of your customers.

GCC LaserPro Application Lab will demonstrate the applications of multi-layer appliqué of Twill. You can first laminate the layers of Twill together, and use the professional GCC LaserProX-Series for cutting.

Simply working with nitrogen or oxygen, S290-200W can cut metals just as easy as average materials.

You can spray more colorful and vibrant patterns on the window by using these spraying plates. Let's follow GCC LaserPro Application Lab to decorate your window!

GCC LaserPro Application Lab is introducing you a special kind of door sign by using MDF along with our laser engraving function, adding more vibrant color and personality.

Using our laser engraving and cutting systems, you can create a hollow carved suede skirt or print the patterns on the clothes by using heat transfer.